GE IC695CHS007LT low temperature, universal backplane
Product Model: IC695CHS007LT
Product Description: The IC695CHS007LT is a high-density I/O carrier module designed for use in GEs PACSystems RX3i platform, providing a robust solution for expanding input and output capabilities in industrial automation applications.
Brand: GE
Origin: United States
Net Weight: 0.5 kg
Dimensions: 120 mm x 60 mm x 100 mm
Power Supply: 24V DC
Input/Output: 32 digital inputs, 32 digital outputs
Communication Interface: Ethernet, Modbus, Profibus
Use: Suitable for industrial automation, process control, and manufacturing environments requiring high-density I/O expansion.
The above parameters are for reference only. Please contact our technical team for precise selection.
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